Polyimide composition for polyimide/copper foil laminate

Details Polyimide composition for polyimide/copper foil laminate Polyimide composition for polyimide/copper foil laminate

1994-02-18

1995-05-23

Nakarani, D. S.

Stock material or miscellaneous articles

Composite

Of metal

4284735, B32B 1508

Patent

active

054180660

ABSTRACT:
A polyimide/copper foil laminate prepared using a polyimide composition that does not require an adhesive layer between the polyimide substrate and the copper foil. A polyimide precursor is first prepared from a monomer composition, which comprises a dianhydride and an imidazole-containing or benzimidazole-containing compound, or mixture thereof. The polyimide precursor is then coated onto a copper foil and subsequently subject to an imidization reaction to form a polyimide/copper foil laminate, which exhibits excellent peel strength and flatness while retaining all the advantageous properties that are characteristic of polyimide resins, such as excellent mechanical strength and heat and chemical resistance. Because the polyimide/copper foil laminates disclosed in the present invention are made without the need to apply an ahsesive layer, the process of manufacturing the same is greatly simplified and the cost of production therefor can be substantially reduced. Furthermore, many of the problems caused by the inferior chemical and/or physical properties of the adhesive layer are completely eliminated.

REFERENCES:
patent: 3247165 (1966-04-01), Rodia
patent: 5077084 (1991-12-01), Konotsune et al.

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