Polyimide composition and prepreg and laminate thereof

Details Polyimide composition and prepreg and laminate thereof Polyimide composition and prepreg and laminate thereof

1992-03-27

1994-01-18

Lesmes, George F.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

4283139, 428458, 4284735, 428325, 528310, 528322, B32B 326, C08G 7310

Patent

active

052798950

ABSTRACT:
A polyimide composition is prepared with a polyimide containing minute hollow spherules made of a glass of a hydroxyl group content and having less than 0.5 mg/m.sup.2. A multilayer substrate for printed-wiring is prepared with this polyimide composition. The substrate possesses a low dielectric constant, dielectric dissipation factor and thermal expansion coefficient.

REFERENCES:
patent: 4956393 (1990-09-01), Boyd et al.

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