Polyimide coating process and material

Details Polyimide coating process and material Polyimide coating process and material

1979-10-02

1980-12-09

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

29588, 29841, 29855, 260308R, 260 338R, 427 82, 4273855, 528350, 528353, H05K 328, H01L 2156

Patent

active

042385288

ABSTRACT:
A protective layer composition, suitable for protecting metal electrodes on components and other microelectronic circuitry, comprises an organic thermoplastic polymeric material, an organic solvent or solvents, and a non-ionic fluorocarbon surfactant as a wetting/leveling/flow control agent. A typical formulation comprises an aromatic polymer which cures to form a polyamide-imide polymer, an organic solvent or a mixture of orangic solvents and a non-ionic fluorocarbon surfactant.

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