Stock material or miscellaneous articles – Composite – Of silicon containing
Reexamination Certificate
2007-05-22
2007-05-22
Moore, Margaret G. (Department: 1712)
Stock material or miscellaneous articles
Composite
Of silicon containing
C525S431000
Reexamination Certificate
active
10892863
ABSTRACT:
The low modulus polyimide adhesive compositions of the present invention contain a low modulus polyimidosiloxane polymer, a thermosetting substantially-non-halogenated epoxy (optionally including an epoxy catalyst), a plasticizer, an insoluble halogen-free flame-retardant filler, and optionally an adhesion promoter. The adhesive can be applied upon (or incorporated into) flexible circuits using a relatively low lamination temperature, generally no higher than 200, 190, 180, 175, 170, 165, 160, 155, or 150° C. The adhesive is generally resistant to unwanted curl even in cases where the adhesive polyimide and the base film polyimide have a coefficient of linear thermal expansions (measured between 50° C. and 250° C.) that differ by more than 10, 15, 20 25, or 30 ppm/° C.
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Definitions of“plasticizer”, Webster's Dictionary; Concise Oxford Dictionary.
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Auman Brian C.
Dueber Thomas E.
Kasowski Robert V.
West Michael W.
E. I. du Pont de Nemours and Company
Moore Margaret G.
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