Polyimide and high-temperature adhesive of polyimide

Details Polyimide and high-temperature adhesive of polyimide Polyimide and high-temperature adhesive of polyimide

1991-06-17

1993-04-27

Bleutge, John C.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156284, 156322, 1563309, 1563311, 1563312, 1563315, C08G 7310

Patent

active

052058948

ABSTRACT:
Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; ##STR1## (where Y is a radical selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non-condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).
Typical examples of polyimide and polyamic acid include where Y is thio radical and R is ##STR2## Y is a bond and R is III or IV, and Y is isopropylidene radical and R is IV.
The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride.
Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.

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Chemical Abstracts: 100:193178(d) (1984).

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