Polyimide and copper metal laminates

Stock material or miscellaneous articles – Composite – Of metal

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Details

156310, 156327, 156332, 428458, 4284735, 428520, B32B 1508

Patent

active

050432273

ABSTRACT:
A laminated structure comprising a copper metal substrate adhered to a polyimide polymer by the use of first and second adhesive resin layers.

REFERENCES:
patent: 3998990 (1976-12-01), Iwami et al.
patent: 4092452 (1978-05-01), Hori et al.
patent: 4132857 (1979-01-01), Scarola et al.
patent: 4656068 (1987-04-01), Raines

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