Polyimide adhesive composition including barbituric acid modifie

Details Polyimide adhesive composition including barbituric acid modifie Polyimide adhesive composition including barbituric acid modifie

1990-08-22

1993-04-06

Carrillo, Ana L.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525420, 4284735, C08L 7900

Patent

active

052004740

ABSTRACT:
A polyimide adhesive composition is a reaction product of polyamic acid and bismaleimide (I) modified by barbituric acid (II) or the derivatives thereof. Once the present composition is directly coated onto copper foil, the bonding force is greatly improved as compared to compositions without (II) or (I) and (II). Therefore, the adhesive normally used in the manufacture of flexible printed circuits boards and tape automated bonding (TAB) is no longer necessary.

REFERENCES:
patent: 4362826 (1982-12-01), Yonezawa et al.
patent: 4985509 (1991-01-01), Matuura et al.
patent: 4987207 (1991-01-01), Yamaya et al.
patent: 5041519 (1991-08-01), Pan et al.

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