Polyhydroxy aromatic compounds, epoxy resins derived therefrom a

Details Polyhydroxy aromatic compounds, epoxy resins derived therefrom a Polyhydroxy aromatic compounds, epoxy resins derived therefrom a

1992-06-18

1994-08-02

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525485, 525486, 528 97, 528153, 528160, C08G 1404, C08G 5962, C08L 6134, C08L 6300, C08L 6302, C08L 6304

Patent

active

053346742

ABSTRACT:
Copolycondensation of a hydroxyl group-containing naphthalene and xylene with an aldehyde compound gives a polyhydroxy aromatic compound. The hydroxyl group-containing naphthalene comprises at least one of naphthols and dihydroxynaphthalenes. In the polyhydroxy aromatic compound, the proportions of the naphthalene unit and xylene unit are 95 to 50:5 to 50 (mole percent), and each molecule contains 2 to 20 naphthalene units. The polyhydroxy aromatic compound is useful as an epoxy resin curing agent. Reaction of the polyhydroxy aromatic compound with an epihalohydrin gives an epoxy resin. An epoxy resin composition can be prepared from the epoxy resin and a curing agent. The epoxy resin composition suited for use as an IC encapsulant gives a cured product having a high glass transition temperature, high heat stability, high mechanical strength, and low moisture absorbing ability, hence good moisture resistance, owing to the presence of xylene in its molecular skeleton, thus cracking is avoided even during soldering treatment. The composition is therefore suitable as an IC encapsulant.

REFERENCES:
patent: 2568313 (1951-09-01), Woolhouse
patent: 3406132 (1968-10-01), Winegartner
patent: 3535185 (1970-10-01), Tveter
patent: 5068293 (1991-11-01), Kaji
patent: 5162400 (1992-11-01), Shiobara
patent: 5166228 (1992-11-01), Shiobara

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