Polygonal wiring for improved package performance

Details Polygonal wiring for improved package performance Polygonal wiring for improved package performance

1987-09-25

1988-11-01

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

361410, 361414, 361416, H05K 100

Patent

active

047821930

ABSTRACT:
A connection arrangement includes a plurality of sets of wiring planes, wherein any connection uses one and only one set of the planes. Each plane is a principal wiring direction. Various economies are affected by arranging the relationship between pairs of wiring planes in a set to have principal wiring directions lying at an acute angle. In one preferred embodiment each set includes a pair of planes and the acute angle between principal wiring directions is 45.degree..

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Jarvela, R. A. et al.; Wirability Enhancement; IBM Technical Disclosure Bulletin; vol. 21, No. 9; Feb. 1979; p. 3624.
Blodgett, Jr., "Microelectronic Packaging", Scientific American, 1983, pp. 86-96.
Ecker et al., "Semiconductor Package Structure", IBM TDB, vol. 20, No. 8, Jan. 1978, pp. 3092-3093.
Layden, "Use of Relatively Diagonal and Rectangular Wiring Planes in Multilayer Packages", IBM TDB, vol. 14, No. 4, Sep. 1971, pp. 1316-1317.
Linsker, "An Iterative-Improvement Penalty-Function-Driven Wire Routing System", IBM J. Res. Develop., vol. 28, No. 5, Sep. 1984, pp. 613-624.

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