Polyetherimide resin/polyester resin blends having improved...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

Reexamination Certificate

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C524S133000, C525S423000, C525S425000, C525S436000

Reexamination Certificate

active

06403684

ABSTRACT:

CROSS-REFERENCE TO RELATED APPLICATIONS
Not applicable.
FEDERALLY SPONSORED RESEARCH
Not applicable.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to thermoplastic resin blends, more specifically to certain transparent blends of polyetherimide resins and polyester resins.
2. Brief Description of the Related Art
Blends of polyetherimide resins and polyester resins derived predominantly from cyclohexanedimethanol and a carbocyclic dicarboxylic acid, such as, for example, a poly(cyclohexane-dimethanol terephthalate) resin that provide improved impact strength are disclosed in U.S. Pat. No. 5,439,987. Blends of polyetherimide resins and copolyesters of terephthalic acid and/or isoterephthalic acid, 1,4-cyclohexanedimethanol and ethylene glycol, that is, certain poly(cyclohexane-1,4-dimethylene-co-ethylene terephthalate) resins that are said to exhibit a high flexural modulus are disclosed in U.S. Pat. No. 5,439,987.
Polyetherimide-polyester blends that exhibit transparency, resistance to elevated temperature, reduced processing temperatures, and further improvements are desired.
SUMMARY OF THE INVENTION
In a first embodiment, the present invention is directed to a transparent thermoplastic resin composition, comprising a mixture, based on 100 parts by weight of the thermoplastic resin composition, of:
(a) from about 1 to about 99 pbw of a polyetherimide resin;
(b) from about 1 to about 99 pbw of a polyester; and
(c) from about 0.001 to about 1.5 pbw sodium benzene phosphinate.
In a preferred embodiment, the present invention is directed to a thermoplastic resin composition, comprising a mixture, based on 100 pbw of the thermoplastic resin composition, of:
(a) from about 1 to about 99 pbw of a polyetherimide resin comprising structural units of the formula:
 wherein each R is independently paraphenylene or metaphenylene and T is a divalent radical according to the formula:
(b) from about 2 to about 15 pbw of a poly(cyclohexane-1,4-dimethylene terephthalate) resin;
(c) from 0 to about 48 pbw of one or more second polyester resins selected from copolyester resins, wherein said copolyester resins each comprise recurring structural units, each structural unit comprises a diol residue and a diacid residue, each of the structural units comprises a 1,4-phenylene or 1,3-phenylene radical as the diacid residue of the structural unit and from 50 to 90 mole percent of the structural units comprise a dimethylene radical as the diol residue of the unit and from 0 to 50 mole percent of the structural units comprise a cyclohexane-1,4-dimethylene radical as the diol residue of the structural unit, and poly(ethylene terephthalate) resins; and
(d) between 0.001 and about 1.5 pbw sodium benzene phosphinate.
DESCRIPTION OF THE DRAWINGS
Not applicable.
DETAILED DESCRIPTION OF THE INVENTION
In a preferred embodiment, the thermoplastic resin composition of the present invention comprises, based on 100 pbw of the thermoplastic resin composition, a mixture of (a) from about 1 to about 99 pbw, more preferably from 80 to 95 pbw polyetherimide resin, (b) from about 1 to about 99 pbw polyester resin, more preferably: (i) from about 5 to about 40 pbw, of the first polyester resin, if from 90 mol % to 100 mol % of the structural units of the first polyester resin comprise a divalent alicyclic hydrocarbon radical as the diol residue of the structural unit or (ii) from about 2 to about 35, more preferably from about 5 to about 25 pbw, most preferably from about 5 to about 20 pbw, of the first polyester resin, if from 50 mol % to less than 90 mol % of the structural units of the first polyester comprise a divalent alicyclic hydrocarbon radical as the diol residue of the structural unit; (c) from about 0 to about 48 pbw, more preferably about 2 to about 35 pbw, most preferably from about 2 to about 20 pbw, of the second polyester resin; (d) up to about 15 pbw, more preferably about 0.001 to about 0.1 pbw sodium benzene phosphinate; and optionally (e) up to about 6.0 pbw 3,4-epoxy cyclohexylmethyl-3,4-epoxy cyclohexanecarboxylate and/or sodium stearate.
In an alternative preferred embodiment, the a thermoplastic resin composition of the present invention comprises, based on 100 pbw of the thermoplastic resin composition, a mixture of from 80 to 95 pbw of the polyetherimide resin, from 5 to 12 pbw of the first polyester resin comprising about 0.5 to about 2.0 pbw 3,4-epoxy cyclohexylmethyl-3,4-epoxy cyclohexanecarboxylate and up to about 0.08 pbw sodium stearate; from 2 to 35 pbw of the third polyester resin; and about 0.005 to about 0.05 pbw sodium benzene phosphinate
In a preferred embodiment, the thermoplastic resin composition of the present invention the first and second polyester resins are present in a weight first polyester resin: weight second polyester resin ratio of from 0.5:1 to 1:4, more preferably from 1:1 to 1:3, and still more preferably from 1:1 to 1:2.
In an alternative preferred embodiment, the thermoplastic resin composition of the present invention the first and third polyester resins are present in a weight first polyester resin: weight third polyester resin ratio of from 1:1 to 1:3, more preferably from 1:1 to 1:2.
Polyetherimide Resins
The polyetherimide resins useful with the present invention are known compounds whose preparation and properties are described in U.S. Pat. Nos. 3,803,085 and 3,905,942, each of which is incorporated herein by reference.
Preferably, the polyetherimide used for preparing the blends of this invention comprises more than 1, typically from about 10 to 1000 or more, and more preferably from about 10 to about 500 structural units, of the formula (I):
wherein T is —O— or a group of the formula —O—Z—O— wherein the divalent bonds of the —O— or the —O—Z—O— group are in the 3,3′, 3, 4′, 4,3′, or the 4,4′ positions; Z includes, but is not limited to, a divalent radical of formulae (II).
wherein X includes, but is not limited to, divalent radicals of the formulae (III):
wherein y is an integer from 1 to about 5, and q is 0 or 1; R includes, but is not limited to, a divalent organic radical: (a) aromatic hydrocarbon radicals having from 6 to about 20 carbon atoms and halogenated derivatives thereof, (b) alkylene radicals having from about 2 to about 20 carbon atoms, (c) cycloalkylene radicals having from about 3 to about 20 carbon atoms, and (d) divalent radicals of the general formula (IV):
where Q includes, but is not limited to, the formulae (V):
where y is an integer from about 1 to about 5.
In one embodiment, the polyetherimide may be a copolymer which, in addition to the etherimide units described above, further contains polyimide structural units of the formula (VI):
wherein R is as previously defined for formula (I) and M includes, but is not limited to, formula (VII):
The polyetherimide can be prepared by any of the methods well known to those skilled in the art, including the reaction of an aromatic bis(ether anhydride) of the formula (VIII):
with an organic diamine of the formula (IX):
wherein T and R are defined as described above in formula (I). In general the reactions can be carried out employing well-known solvents, e.g., o-dichlorobenzene, m-cresol/toluene and the like to effect interaction between the anhydride of formula (VIII) and the diamine of formula (IX), at temperatures of about 100° C. to about 250° C. Alternatively, the polyetherimide can be prepared by melt polymerization of aromatic bis(ether anhydride)s and diamines accomplished by heating a mixture of the ingredients to elevated temperatures with concurrent stirring. Generally melt polymerizations employ temperatures of about 200° C. to about 400° C. Chain stoppers and branching agents may also be employed in the reaction.
Examples of specific aromatic bis(ether anhydrides) and organic diamines are disclosed, for example, in U.S. Pat. Nos. 3,972,902 and 4,455,410, which are incorporated herein by reference.
Illustrative examples of aromatic bis(ether anhydride)s of formula (VIII) include: 2,2-bis[4-(3,4-dicarboxyp

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