Polyetherimide/epoxyimide resin composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

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525431, 525432, 525436, 525903, 524539, C08L 6300

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active

048086762

ABSTRACT:
A polyetherimide/epoxyimide resin composition prepared by mixing a polyetherimide having a repeating unit represented, for example, by the formula of: ##STR1## with an epoxyimide represented by the following general formula of: ##STR2## wherein R is, for example, selected from the group consisting of diphenyl ether, diphenylmethane, diphenyl sulfone, m-phenylene, p-phenylene and 1,6-hexamehtylene;
in a mixing ratio, by weight, of preferably from 6:1 to 1:1. The resin composition is mixed in a solvent to form a solution from which a film may be formed through a flow-coating method. The film made of the polyetherimde/epoxyimide resin composition of the invention, after being removed of the solvent followed by thermal treatment at a temperature of 150.degree. C. to 220.degree. C. for 1 to 3 hours, has improved thermal resistance, adaptability for adhesive, and low moisture permeability.

REFERENCES:
patent: 4557860 (1985-12-01), DiSalvo et al.
patent: 4604230 (1986-08-01), Goswami et al.
patent: 4652398 (1987-03-01), Goswami et al.
patent: 4769475 (1988-09-01), Sasaki et al.
Sampe Quarterly, vol. 13, 1981, pp. 20-25.
L. H. Sperling, "Interpenetrating Polymer Networks and Related Materials", Plenum Press, N.Y., 1981, pp. 1-9.

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