Polyester film for forming printed circuit

Details Polyester film for forming printed circuit Polyester film for forming printed circuit

1984-11-19

1986-02-11

Ives, Patricia C.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

428480, 428483, 428910, 264176R, 264346, B32B 2706, B29C 2500

Patent

active

045698856

ABSTRACT:
A polyester film for printed circuits to be used as a base in a printed circuit base plate or as a base and/or cover layer in a printed circuit board, which undergoes a degree of dimensional stability of not more than 1% in both the longitudinal and transverse directions when kept at 150.degree. C. for 30 minutes, and which is obtained by heat treating an extrusion molded and stretched polyester film at 150.degree. C. to 240.degree. C. without applying tension.

REFERENCES:
patent: 3669931 (1972-06-01), Annis et al.
patent: 3962520 (1976-06-01), Watanabe et al.

Affiliated with

Also associated with

Rating

Polyester film for forming printed circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyester film for forming printed circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyester film for forming printed circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1205122