Polyelectrolyte dispensing polishing pad, production thereof...

Details Polyelectrolyte dispensing polishing pad, production thereof... Polyelectrolyte dispensing polishing pad, production thereof...

2005-01-11

2005-01-11

Vinh, Lan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S692000, C438S693000, C216S088000, C216S089000

Reexamination Certificate

active

06841480

ABSTRACT:
A polyelectrolyte dispensing polishing pad, a process for its production and a method of polishing, e.g., chemical mechanical polishing (CMP), a substrate such as a semiconductor wafer, are provided. The pad is usable for CMP planarization of an oxide or metal layer on the wafer. The pad has a polishing layer of erodible binder material containing uniformly distributed therein both abrasive particles and a water soluble ionizable electrolyte substance such as a polyelectrolyte, such that during polishing the binder material incrementally erodes and the abrasive particles and electrolyte substance incrementally release into direct contact with the substrate. The electrolyte substance inhibits CMP removal of silicon nitride, e.g., as a stop layer, under an upper oxide or metal layer, such that the upper layer is selectively polished and the CMP stops on the stop layer leaving the latter intact.

REFERENCES:
patent: 5152917 (1992-10-01), Pieper et al.
patent: 5342419 (1994-08-01), Hibbard
patent: 5368619 (1994-11-01), Culler
patent: 5378251 (1995-01-01), Culler et al.
patent: 5733176 (1998-03-01), Robinson et al.
patent: 5782675 (1998-07-01), Southwick
patent: 5855804 (1999-01-01), Walker
patent: 5876490 (1999-03-01), Ronay
patent: 5897426 (1999-04-01), Somekh
patent: 5919082 (1999-07-01), Walker et al.
patent: 5958794 (1999-09-01), Bruxvoort et al.
patent: 5968280 (1999-10-01), Ronay
patent: 5972124 (1999-10-01), Sethuraman et al.
patent: 5972792 (1999-10-01), Hudson
patent: 6019670 (2000-02-01), Cheng et al.
patent: 6638143 (2003-10-01), Wang et al.
patent: 6677239 (2004-01-01), Hsu et al.

Affiliated with

Also associated with

Rating

Polyelectrolyte dispensing polishing pad, production thereof... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyelectrolyte dispensing polishing pad, production thereof..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyelectrolyte dispensing polishing pad, production thereof... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3428023