Polycrystalline silicon thin film, fabrication method...

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Non-single crystal – or recrystallized – material with...

Reexamination Certificate

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C257SE29003, C257S075000, C257S070000

Reexamination Certificate

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10694030

ABSTRACT:
A polycrystalline silicon thin film to be used in display devices, the thin film having adjacent primary grain boundaries that are not parallel to each other, wherein an area surrounded by the primary grain boundaries is larger than 1 μm2, a fabrication method of the polycrystalline silicon thin film, and a thin film transistor fabricated using the method.

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Chinese Office Action issued on Feb. 10, 2006, in Chinese Patent Application No. 2004100036565 (in Chinese with English translation).
English Abstract of CN1389600A cited in Chinese Office Action issued on Feb. 10, 2006, in Chinese Patent Application No. 2004100036565.

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