Polyarylene sulfide resin composition

Details Polyarylene sulfide resin composition Polyarylene sulfide resin composition

1998-01-29

2000-03-28

Warzel, Mark L.

Stock material or miscellaneous articles

Hollow or container type article

Polymer or resin containing

525440, 525446, 525452, 525454, 525464, 525487, 525537, 524539, 524588, 524589, B29D 2200, C08L 8104, C08L 6703

Patent

active

060429100

ABSTRACT:
A polyarylene sulfide resin composition comprising (A) a polyarylene sulfide resin, (B) an aliphatic or saturated cyclic polycarbodiimide resin or a precursor thereof, and preferably (C) reactive silicone compound grains, and (D) a polyethylene naphthalate resin or (E) a filler, which improves excellent properties exhibited by polyarylene sulfide resins, and which is also endowed with an excellent adhesion characteristics to adhesives such as epoxy resins. In addition, a molded article obtained by molding a polyarylene sulfide resin composition endowed with such excellent properties is useful as a container for accommodating an electric component material. Such a molded article may also be used as an electronic component having conductive portions which are totally or partially accommodated in the container, wherein the conductive portions are seled by a sealant encapsulated in the container.

REFERENCES:
patent: 4929665 (1990-05-01), Inoue et al.
patent: 5008363 (1991-04-01), Mallon et al.
patent: 5110861 (1992-05-01), Togami et al.
patent: 5804626 (1998-09-01), Rogers et al.

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