Polyarylene sulfide molding compounds and their use as an encaps

Details Polyarylene sulfide molding compounds and their use as an encaps Polyarylene sulfide molding compounds and their use as an encaps

1990-12-04

1991-07-16

Foelak, Morton

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Treating polymer containing material or treating a solid...

528495, 528388, C08F 600

Patent

active

050326740

ABSTRACT:
The invention relates to molding compounds of polyarylene sulfides (PAS), preferably polyphenylene sulfides (PPS), which have a low ion content and delayed crystallization and to their use as an encapsulating compound for active and passive electronic components.

REFERENCES:
patent: 4730034 (1988-03-01), Nesheiwat et al.
patent: 4841022 (1989-06-01), Nakamura et al.
patent: 4845190 (1989-07-01), Inoue et al.

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