Polyamine flux composition and method of soldering

Details Polyamine flux composition and method of soldering Polyamine flux composition and method of soldering

2010-12-02

2011-12-06

Stoner, Kiley (Department: 1735)

Metal fusion bonding

Process

Plural joints

C228S207000, C228S223000, C228S224000, C228S248100, C148S023000, C148S024000

Reexamination Certificate

active

08070044

ABSTRACT:
A polyamine flux composition is provided, comprising, as an initial component: a polyamine fluxing agent represented by formula I:wherein R1, R2, R3and R4are independently selected from a hydrogen, a substituted C1-80alkyl group, an unsubstituted C1-80alkyl group, a substituted C7-80arylalkyl group and an unsubstituted C7-80arylalkyl group; wherein R7comprises at least two tertiary carbons and is selected from an unsubstituted C5-80alkyl group, a substituted C5-80alkyl group, an unsubstituted C12-80arylalkyl group and a substituted C12-80arylalkyl group; and, wherein the two nitrogens shown in formula I are each separately bound to one of the at least two tertiary carbons of R7; with the proviso that when the polyamine fluxing agent of formula I is represented by formula Ia:then zero to three of R1, R2, R3and R4is(are) hydrogen. Also provided is a method of soldering an electrical contact using the polyamine flux composition.

REFERENCES:
patent: 2632022 (1959-03-01), Bortnick
patent: 2897179 (1959-07-01), Schecter et al.
patent: 3488831 (1970-01-01), Ravve
patent: 3740831 (1973-06-01), Jordan et al.
patent: 3814638 (1974-06-01), Warwick et al.
patent: 4028143 (1977-06-01), Stayner et al.
patent: 4165244 (1979-08-01), Jacobs
patent: 4196024 (1980-04-01), Kenyon
patent: 4360144 (1982-11-01), Cuddy et al.
patent: RE32309 (1986-12-01), Hwang
patent: 5011546 (1991-04-01), Frazier et al.
patent: 5041169 (1991-08-01), Oddy et al.
patent: 5145722 (1992-09-01), Kaspaul
patent: 5531838 (1996-07-01), Arldt et al.
patent: 5571340 (1996-11-01), Schneider et al.
patent: 5932030 (1999-08-01), Fukasawa et al.
patent: 5958151 (1999-09-01), Gao et al.
patent: 5963355 (1999-10-01), Iizuka
patent: 5989362 (1999-11-01), Diamant et al.
patent: 6217671 (2001-04-01), Henderson et al.
patent: 6234381 (2001-05-01), Hasegawa et al.
patent: 6367150 (2002-04-01), Kirsten
patent: 6758389 (2004-07-01), Odaka et al.
patent: 6887319 (2005-05-01), Suga et al.
patent: 6926849 (2005-08-01), Taguchi et al.
patent: 7575150 (2009-08-01), Saito et al.
patent: 2001/0019075 (2001-09-01), Abe et al.
patent: 2001/0045244 (2001-11-01), Akaike et al.
patent: 2002/0190370 (2002-12-01), Shi et al.
patent: 2003/0111519 (2003-06-01), Kinney et al.
patent: 2003/0159761 (2003-08-01), Ikeda et al.
patent: 2005/0067395 (2005-03-01), Shindo et al.
patent: 2005/0131106 (2005-06-01), Tonapi et al.
patent: 2005/0170188 (2005-08-01), Campbell et al.
patent: 2006/0102691 (2006-05-01), Toyama et al.
patent: 2006/0147683 (2006-07-01), Ikeda et al.
patent: 2006/0272747 (2006-12-01), Wang et al.
patent: 2006/0275608 (2006-12-01), Tonapi et al.
patent: 2007/0186997 (2007-08-01), Ikeda et al.
patent: 2007/0241170 (2007-10-01), Ikeda et al.
patent: 2007/0277373 (2007-12-01), Takai et al.
patent: 2008/0023108 (2008-01-01), Wang et al.
patent: 2008/0124568 (2008-05-01), Duchesne et al.
patent: 2008/0156852 (2008-07-01), Prakash
patent: 2008/0179383 (2008-07-01), Sakurai et al.
patent: 2009/0018239 (2009-01-01), Woods et al.
patent: 2010/0143658 (2010-06-01), Lawrence
patent: 2010/0175790 (2010-07-01), Duchesne et al.
patent: 2011/0100512 (2011-05-01), Bedard et al.
STIC search (no date available).
Copending U.S. Appl. No. 12/958,495.
Copending U.S. Appl. No. 12/958,487.
Copending U.S. Appl. No. 12/958,493.
Copending U.S. Appl. No. 12/958,473.

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