Polyamide thermosets

Organic compounds -- part of the class 532-570 series – Organic compounds – Heterocyclic carbon compounds containing a hetero ring...

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525282, 525432, 526262, 528310, 528322, C07D20956

Patent

active

051985519

ABSTRACT:
The present invention provides (1) curable polyamide monomers represented by the formula: R.sup.1 -A.sup.1 -B.sup.1 -A.sup.2 -B.sup.2 -A.sup.3 -R.sup.2 where R.sup.1 and R.sup.2 are radicals selected from the group consisting of maleimide, substituted maleimide, nadimide, substituted nadimide, ethynyl, and (C(R.sup.3).sub.2).sub.2 where R.sup.3 is hydrogen with the proviso that the two carbon atoms of (C(R.sup.3).sub.2).sub.2 are bound on the aromatic ring of A.sup.1 or A.sup.3 to adjacent carbon atoms, A.sup.1 and A.sup.3 are 1,4-phenylene and the same where said group contains one or more substituents selected from the group consisting of halo, e.g., fluoro, chloro, bromo, or iodo, nitro, lower alkyl, e.g., methyl, ethyl, and propyl, lower alkoxy, e.g., methoxy, ethoxy, or propoxy, and fluoroalkyl or fluoroalkoxy, e.g., trifluoromethyl, pentafluoroethyl and the like, A.sup.2 is selected from the group consisting of 1,4-phenylene, 4,4'-biphenyl, 2,6-naphthylene and the same where said groups contain one or more substitutents selected from the group consisting of halo, e.g., fluoro, chloro, bromo, or iodo, nitro, lower alkyl, e.g., methyl, ethyl, and propyl, lower alkoxy, e.g., methoxy, ethoxy, or propoxy, and fluoroalkyl or fluoroalkoxy, e.g., trifluoromethyl, pentafluoroethyl and the like, and B.sup.1 and B.sup.2 are selected from the group consisting of --C(O)--N(H)-- and --N(H)--C(O)--, (2) thermoset polyamide compositions comprised of cured segments derived from monomers represented by the formula: R.sup.1 -A.sup.1 -B.sup.1 -A.sup.2 -B.sup.2 -A.sup.3 -R.sup.2 as described above, and curable blends of at least two of the polyamide monomers and (4) processes of preparing the curable polyamide monomers.

REFERENCES:
patent: 3651012 (1972-03-01), Holub
patent: 3738969 (1973-06-01), Holub
patent: 3766302 (1973-10-01), Holub
Andrea E. Hoyt, Brian C. Benicewicz and Samuel J. Huang Polym. Prepr. (Am. Chem. Soc., Div. Polym. Chem.) 30(2), 536-7, 1989.

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