Polyamide resin-containing varnish and its use

Details Polyamide resin-containing varnish and its use Polyamide resin-containing varnish and its use

2005-10-18

2005-10-18

Hightower, P. Hampton (Department: 1711)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

C528S086000, C528S211000, C528S212000, C528S322000, C525S088000, C525S314000, C525S420000, C525S422000, C525S432000

Reexamination Certificate

active

06956100

ABSTRACT:
An object of the present invention is to provide a polyamide resin composition from which the solvent is easily removed during film formation and which gives a film or adhesive layer reduced in residual solvent content. It is suitable for use especially as vanish. The composition and vanish are characterized by comprising as essential ingredients a phenolic hydroxyl group-having aromatic polyamide resin and a cycloalkanone as a solvent and preferably further containing a curable resin.

REFERENCES:
patent: 5686557 (1997-11-01), Kiyohara et al.
patent: 0 388 243 (1990-09-01), None
patent: 4-170431 (1992-06-01), None
patent: 6-299133 (1994-10-01), None
patent: 8-143661 (1996-06-01), None
patent: 8-217959 (1996-08-01), None
patent: 9-31154 (1997-02-01), None
patent: 11-204521 (2001-02-01), None

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