Polyamide resin composition and molded article thereof

Details Polyamide resin composition and molded article thereof Polyamide resin composition and molded article thereof

2006-04-11

2006-04-11

Woodward, Ana (Department: 1711)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

C524S317000, C524S425000, C524S430000, C524S449000, C524S456000, C524S538000

Reexamination Certificate

active

07026383

ABSTRACT:
A polyamide resin composition comprises a polyamide resin component (A) and a metallic soap component (B), wherein the polyamide resin component (A) comprises a dicarboxylic acid component (a-1), which comprises a terephthalic acid component and an aromatic dicarboxylic acid component other than the terephthalic acid component and/or an aliphatic dicarboxylic acid component of 4 to 20 carbon atoms, and a diamine component (a-2), which comprises an aliphatic diamine component; and the metallic soap component (B) comprises a metallic soap comprising an aliphatic carboxylic acid and a monovalent or divalent metal salt The polyamide resin composition has excellent heat resistance and is favorably used as a molding material for electric or electronic parts and automotive parts. The polyamide resin composition is excellent in flowability, mold-releasing properties and shot stability in the injection molding process.

REFERENCES:
patent: 5183843 (1993-02-01), Sakai et al.
patent: 2763348 (1998-03-01), None
patent: 11-12460 (1999-01-01), None

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