Polyamide resin composition and housing for electronic equipment

Details Polyamide resin composition and housing for electronic equipment Polyamide resin composition and housing for electronic equipment

1993-08-25

1995-11-28

Carrillo, Ana L.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524504, 524449, 524494, 525133, 525391, 525397, C08K 300, C08L 7112

Patent

active

054709091

ABSTRACT:
A polyamide resin composition including 100 parts by weight of a resin composition containing of 20 to 80% by weight of an aromatic polyamide resin and 80 to 20% by weight of a modified polyphenylene ether resin (the total amount in % by weight of the aromatic polyamide resin and the modified polyphenylene ether resin being 100% by weight) and, incorporated in the resin composition, 0.5 to 30 parts by weight of a liquid-crystalline polymer, 0.01 to 3 parts by weight of a compatibilizing agent and 2 to 40 parts by weight of an inorganic filler and optionally a rubber component. The plate thickness of the resin molded articles may be reduced to 2 mm or less, and even further to 1 mm or less without deterioration of the properties thereof.

REFERENCES:
patent: 4438236 (1984-03-01), Cogswell et al.
patent: 4798865 (1989-01-01), Grant et al.
patent: 4859739 (1989-08-01), Yates, III et al.
patent: 5006403 (1991-04-01), Isayev
patent: 5254304 (1993-10-01), Adachi et al.
patent: 5260380 (1993-11-01), Isayev
G. Kiss, Polymer Engineering and Science, vol. 27, No. 6, pp. 410-423, Mar. 1987, Summit, N.J.
T. Chung, Plastics Engineering, pp. 39-41, Oct. 1987, Summit, N.J.
Patent Abstract of Japan, vol. 16, No. 94, (M-1219) 9 Mar. 1992 of JP-A-03 274 121 (UNITIKA) 5 Dec. 1991.

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