Polyamide resin composition and housing for electronic equipment

Details Polyamide resin composition and housing for electronic equipment Polyamide resin composition and housing for electronic equipment

1995-06-07

1997-05-20

Woodward, Ana

Stock material or miscellaneous articles

Structurally defined web or sheet

Physical dimension specified

525391, B32B 3300

Patent

active

056310706

ABSTRACT:
A polyamide resin composition including 100 parts by weight of a resin composition containing of 20 to 80% by weight of an aromatic polyamide resin and 80 to 20% by weight of a modified polyphenylene ether resin (the total amount in% by weight of the aromatic polyamide resin and the modified polyphenylene ether resin being 100% by weight) and, incorporated in the resin composition, 0.5 to 30 parts by weight of a liquid-crystalline polymer, 0.01 to 3 parts by weight of a compatibilizing agent and 2 to 40 parts by weight of an inorganic filler and optionally a rubber component. The plate thickness of the resin molded articles may be reduced to 2 mm or less, and even further to 1 mm or less without deterioration of the properties thereof.

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patent: 4859739 (1989-08-01), Yates, III et al.
patent: 5006403 (1991-04-01), Isayev
patent: 5254304 (1993-10-01), Adachi et al.
patent: 5260380 (1993-11-01), Isayev
patent: 5310776 (1994-05-01), Takagi et al.
patent: 5360866 (1994-11-01), Arashiro et al.
G. Kiss, Polymer Engineering and Science, vol. 27, No. 6, pp. 410-423, Mar. 1987, Summit, New Jersey.
T. Chung, Plastics Engineering, pp. 39-41, Oct. 1987, Summit, New Jersey.

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