Polyamide resin, and polyamide resin compositions

Details Polyamide resin, and polyamide resin compositions Polyamide resin, and polyamide resin compositions

1990-10-16

1992-09-15

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525 92, C08L 7700

Patent

active

051479443

ABSTRACT:
A polyamide resin which comprises a molten reaction mixture composed of 10-90% by weight of a polyamide (A1) from xylylenediamine and a C.sub.6 -C.sub.20 .alpha.,.beta.-linear aliphatic dibasic acid and 90-10% by weight of polyamide-6 (A2). The polyamide resin has either a single glass transition temperature differing from that of both (A1) and (A2), or two glass transition temperatures both differing from those of (A1) and (A2), the difference between the two temperatures being less than 10.degree. C. There are also provided a toughened polyamide resin composition comprising (A) 100 parts by weight of the polyamide resin, and (B) 5 to 80 parts by weight of an elastomer such as one composed mainly of a block-copolymerized elastomer which has been modified with an unsaturated dicarboxylic acid or a derivative thereof and hydrogenated.

REFERENCES:
patent: 4849471 (1989-07-01), Saito et al.
patent: 4863996 (1989-09-01), Nakazima et al.
patent: 4885340 (1989-12-01), Hamada et al.
patent: 4980407 (1990-12-01), Okumoto et al.
patent: 4996264 (1991-02-01), Aonuma et al.
patent: 5006601 (1991-04-01), Lutz et al.
Mitsubishi Gas Chem. Co., Patent Abstracts of Japan, vol. 14, No. 37 Jan. 24, 1990 JP-A-01 272 662.
Seifforth et al., Chemical Abstracts, vol. 89, 1978 Nov. 27, 1978, p. 3, Abstract No. 180411d.

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