Polyamide molding materials with an improved flowability,...

Details Polyamide molding materials with an improved flowability,... Polyamide molding materials with an improved flowability,...

2011-03-22

2011-03-22

Jagannathan, Vasu (Department: 1764)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

C524S098000, C524S495000, C524S496000, C524S451000, C524S449000, C524S445000, C524S497000, C524S401000, C524S418000, C524S210000, C524S227000, C525S432000, C528S332000, C528S335000, C528S347000, C546S244000, C252S511000

Reexamination Certificate

active

07910652

ABSTRACT:
The invention relates to a polyamide moulding compound containing 70 to 99.5% by weight of at least one thermoplastic polyamide and 0.5 to 30% by weight of at least one polyamide oligomer with linear or branched chain structure with a number average molar mass of 800 to 5000 g/mol with basic end groups which are at least partially NH2end groups, and carboxyl end groups, one of these end groups being present in excess and the concentration of the end group present in excess being at most 300 mmol/kg.

REFERENCES:
patent: 3687904 (1972-08-01), Middleton
patent: 3711447 (1973-01-01), Jakob et al.
patent: 4847333 (1989-07-01), Lubowitz et al.
patent: 5112908 (1992-05-01), Epstein
patent: 5154881 (1992-10-01), Rutz et al.
patent: 5274033 (1993-12-01), Epstein
patent: 5288799 (1994-02-01), Schmid
patent: 5618909 (1997-04-01), Lofquist et al.
patent: 5643502 (1997-07-01), Nahass et al.
patent: 5744433 (1998-04-01), Storström et al.
patent: 5763561 (1998-06-01), Keske
patent: 6150496 (2000-11-01), Ilg et al.
patent: 6267148 (2001-07-01), Katayama et al.
patent: 6528572 (2003-03-01), Patel et al.
patent: 6548591 (2003-04-01), Koning et al.
patent: 6942823 (2005-09-01), Terada et al.
patent: 2003/0029272 (2003-02-01), Vidarsson et al.
patent: 2004/0082729 (2004-04-01), Terada et al.
patent: 2004/0171720 (2004-09-01), Dames et al.
patent: 2005/0084686 (2005-04-01), Imaizumi
patent: 2006/0014866 (2006-01-01), Ottenheijm
patent: 2008/0268167 (2008-10-01), Gerteisen et al.
patent: 2009/0131569 (2009-05-01), Schwitter et al.
patent: 2009/0131674 (2009-05-01), Schmid et al.
patent: 3901716 (1990-07-01), None
patent: 3901717 (1990-07-01), None
patent: 3930089 (1991-03-01), None
patent: 3932912 (1991-04-01), None
patent: 4131926 (1992-04-01), None
patent: 19537614 (1997-04-01), None
patent: 19745099 (1999-04-01), None
patent: 10247470 (2004-04-01), None
patent: 10255044 (2004-06-01), None
patent: 272695 (1988-06-01), None
patent: 0272695 (1988-06-01), None
patent: 0272695 (1988-06-01), None
patent: 0261020 (1990-12-01), None
patent: 0555578 (1993-08-01), None
patent: 0555578 (1993-08-01), None
patent: 0345645 (1995-08-01), None
patent: 0345645 (1995-08-01), None
patent: 0272695 (1997-07-01), None
patent: 0957131 (1999-11-01), None
patent: 0957131 (1999-11-01), None
patent: 1125985 (2001-08-01), None
patent: 0953796 (2003-07-01), None
patent: 0957131 (2003-07-01), None
patent: 1217039 (2004-07-01), None
patent: 1454963 (2004-09-01), None
patent: 2005-146269 (2005-09-01), None
patent: 90/08807 (1990-08-01), None
patent: 02/083345 (2002-10-01), None
patent: 02/083346 (2002-10-01), None
patent: 2004/055109 (2004-07-01), None
patent: 2004/055109 (2004-07-01), None
patent: 2005/000953 (2005-01-01), None
patent: 2005/000953 (2005-01-01), None
patent: 2005/032817 (2005-04-01), None
patent: 2006/122633 (2006-04-01), None
English Language Abstract of JP 2005-146269 A, Sep. 6, 2005.
R.G. Gilg, “Carbon Black for Conductive Plastic Materials” in: Electrically conductive Plastic Materials, publishers: H.J. Mair, S. Roth, 2ndEdition, Carl Hanser Verlag, 1989, Munich Vienna, pp. 21-36 (Russ Fuer Leitfahige Kunststoffe, p. 21-36).
Plastics 2000, 9, pp. 116-118 (Technische Kunststoffe 2000, p. 116-118).
Holleman-Widberg, “Textbook of Inorganic Chemistry” 91st-100thedition, pp. 701-702, 1985 (Lehrbuch der anorganishen Chemie, p. 701-702, 1985).
U.S. Appl. No. 11/914,916 to Eduard Schmid et al., I.A. filed Apr. 24, 2006, entitled “Polymide Oligomers and Their Use”.
U.S. Appl. No. 12/550,239, to Schwitter et al.

Affiliated with

Also associated with

Rating

Polyamide molding materials with an improved flowability,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyamide molding materials with an improved flowability,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyamide molding materials with an improved flowability,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2696349