Polyamide molding compositions

Plastic and nonmetallic article shaping or treating: processes – Forming continuous or indefinite length work – Shaping by extrusion

Reexamination Certificate

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Details

C524S284000, C524S323000, C524S356000, C524S379000, C524S514000

Reexamination Certificate

active

07138080

ABSTRACT:
A thermoplastic molding composition comprising polyamide is disclosed. The composition that contains vinyl (co)polymer and an optional solvent is useful in application where inhibited crystallization of polyamide is desirable, including laser-welding.

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patent: 6455450 (2002-09-01), Hofmann
patent: 1161911 (1969-08-01), None
patent: 7150414 (1995-06-01), None
patent: 2002-306059 (2002-10-01), None
Database WPI, Section Ch, Week 199532, Derwent Publications Ltd., London, GB; Class A14, AN 1995-244071; XP002291687 & JP 07 150414 A (Toray Ind Inc) Jun. 13, 1995, Zusammenfassung.
Database WPI, Section Ch, Week 200326, Derwent Publications Ltd., London, GB; Class A14, AN 2003-260298; XP002291686 & JP 2002 306059 A (null) Oct. 22, 2002, in der Anmeldung erwähnt Zusammenfassung.

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