Polyamide laminates containing copper salts

Details Polyamide laminates containing copper salts Polyamide laminates containing copper salts

1980-12-29

1981-11-24

Robinson, Ellis P.

Stock material or miscellaneous articles

Composite

Of polycarbonate

428 35, 4284744, 4284752, 4284758, 428523, 4284761, 428480, 428483, 4284763, 4284769, 4284777, B32B 2736

Patent

active

043025110

ABSTRACT:
A laminate structure having at least one layer of a polyamide containing from 0.001 to 1.0 parts, based on the weight of the polyamide, of a copper cation containing material. The polyamide layer is contiguous to at least one opposing layer. The opposing layer contains an effective amount of functional groups selected from the group consisting of acid groups, metal salts of the acid, acid anhydrides, carbonates and mixtures thereof.

REFERENCES:
patent: 3264272 (1966-08-01), Rees
patent: 3355319 (1967-11-01), Rees
patent: 3527731 (1970-09-01), Champ
patent: 3845163 (1974-10-01), Murch
patent: 3873643 (1975-03-01), Wu
patent: 3882194 (1975-05-01), Krebaum
patent: 4215176 (1980-07-01), Tuller

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