Polyamide-imide resin, flexible metal-clad laminate, and...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From carboxylic acid or derivative thereof

Reexamination Certificate

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Details

C528S322000, C528S332000, C528S353000

Reexamination Certificate

active

07728102

ABSTRACT:
The present invention provides a non-halogen polyamide-imide resin soluble in an amide solvent at a concentration of 10%, the resulting varnish, when stored at 5° C. for 1 month, exhibiting a solution viscosity change ((solution viscosity after 1 month−initial solution viscosity)/initial solution viscosity), expressed as an absolute value, of not greater than 3.0, and the resin having a moisture absorption (25° C., 90% RH, 24 hours) of not greater than 2.0%; a flexible metal-clad laminates using such a resin; and a flexible printed wiring board prepared from such a flexible metal-clad laminate by circuit formation. The flexible metal-clad laminate of the invention does not curl under any conditions, including humid conditions, and exhibits excellent dimensional stability since the heat resistant resin used as an insulation material has low moisture absorption and low thermal expansion coefficient and there is less internal stress in the flexible metal-clad laminate. Moreover, since the solder heat resistance and the insulation properties are not impaired even after humidification and since the heat resistant resin is soluble in organic solvents with high solution stability, the flexible metal-clad laminate of the invention can be inexpensively produced.

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Sumibe Techno Research K.K. (ed.), “Yakushin suru Polyimide no Saishin Doko II-Tayoka suru Shurui. Tokusei. Kakosei to Yoto Kakudai no Jittai-” (Dec. 2000), pp. 195-208.
Nagaoka,Plastics, 37(7): 87-95 (1986).

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