Polyamide-imide resin composition

Details Polyamide-imide resin composition Polyamide-imide resin composition

1982-09-30

1985-07-23

Pertilla, Theodore E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

174110SR, 524323, 524351, 524352, 524399, 524400, 524589, 525420, 525424, 525425, 525428, 525429, 428378, 428418, 4284258, 428458, C08L 7908

Patent

active

045309752

ABSTRACT:
A polyamide-imide resin composition comprising (A) a polyamide-imide resin modified with a polyisocyanate containing one or more isocyanurate rings and a lactam and (B) at least one member selected from the group consisting of (i) an alkoxy modified amino resin, (ii) a polyisocyanate containing one or more isocyanurate rings, (iii) a phenol-formaldehyde resin, (iv) an epoxy resin, (v) a polyester resin having one or more hydroxyl groups obtained by using terephthalic acid and/or isophthalic acid as an acid component, and (vi) a metal salt of Sn, Mn, Co or Zn, can give fast curing properties to the resin composition without lowering heat resistance, flexibility, abrasion resistance and also giving good surface appearance to the coating.

REFERENCES:
patent: 3555113 (1971-01-01), Sattler
patent: 3852106 (1974-12-01), Incremona et al.
patent: 3862261 (1975-01-01), Stoddard
patent: 4088637 (1978-05-01), Zecher et al.
patent: 4294952 (1981-10-01), Mukoyama et al.

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