Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...
Patent
1986-01-15
1987-10-20
Bowers, Jr., Charles L.
Radiation imagery chemistry: process, composition, or product th
Diazo reproduction, process, composition, or product
Composition or product which contains radiation sensitive...
430197, 430281, 430283, 430285, 430927, G03C 171, G03C 168, G03C 170
Patent
active
047013001
ABSTRACT:
Photoresist formulations for forming relief structures from highly heat-resistant polyimide polymers, containing in an organic solvent in essence at least
REFERENCES:
patent: Re30186 (1980-01-01), Rubner et al.
patent: 4251619 (1981-02-01), Kurita
patent: 4287294 (1981-09-01), Rubner et al.
patent: 4329419 (1982-05-01), Goff et al.
patent: 4329556 (1982-05-01), Rubner et al.
patent: 4369247 (1987-01-01), Goff et al.
patent: 4540650 (1985-09-01), Klug et al.
patent: 4547455 (1985-10-01), Hiramoto et al.
patent: 4548891 (1985-10-01), Riediker et al.
Herold Thomas
Klug Rudolf
Merrem Hans J.
Bowers Jr. Charles L.
Merck Patent Gesellschaft mit beschrankter Haftung
LandOfFree
Polyamide ester photoresist formulations of enhanced sensitivity does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polyamide ester photoresist formulations of enhanced sensitivity, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyamide ester photoresist formulations of enhanced sensitivity will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1611420