Polyamide composition

Details Polyamide composition Polyamide composition

2006-03-07

2006-03-07

Hightower, P. Hampton (Department: 1711)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

C528S322000, C528S332000, C528S335000, C528S336000, C528S340000, C524S447000, C524S514000, C524S538000, C524S606000, C524S607000, C524S497000, C525S066000, C525S182000, C525S432000, C525S420000, C523S200000

Reexamination Certificate

active

07009029

ABSTRACT:
Provided is a polyamide composition comprising 100 parts by weight of (A) a polyamide having dicarboxylic acid units containing 60 to 100 mol % of terephthalic acid units, and diamine units containing 60 to 100 mol % of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units, and 5 to 100 parts by weight of (B) a titanium oxide with an average particle size of 0.1 to 0.5 μm. The polyamide composition shows excellent heat resistance enough to withstand the SMT process, and gives a molded article with excellent whiteness and surface-reflectance.

REFERENCES:
patent: 5478878 (1995-12-01), Nagaoka et al.
patent: 5670608 (1997-09-01), Oka et al.
patent: 6414064 (2002-07-01), Matsuoka et al.
patent: 6887930 (2005-05-01), Uchida et al.
patent: 0 659 799 (1995-06-01), None
patent: 59-113049 (1984-06-01), None
patent: 3-84060 (1991-04-01), None

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