Polyamide based on dimer fatty acid

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From carboxylic acid or derivative thereof

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528310, 528322, 528338, 528340, 525420, 5254205, 525426, 156325, 156326, C08G 6934

Patent

active

057192553

DESCRIPTION:

BRIEF SUMMARY
BACKGROUND OF THE INVENTION

1. Field of the Invention
This invention relates to a polyamide based on dimer fatty acid and to its use as a hotmelt adhesive for PVC.
2. Discussion of Related Art
Polyamides of the type in question are known. Thus, DE 23 61 486 describes a polyamide prepared from 0.5 to 0.8 equivalent of a polymeric fatty acid containing 70 to 100% by weight of dimeric fatty acid, 0.2 to 0.5 equivalent of a co-dicarboxylic acid with the general formula HOOC--R--COOH, where R is an alkylene group containing 4 to 10 carbon atoms, 0 to 0.6 equivalent of ethylenediamine and 0.4 to 1.0 equivalent of piperazine, the equivalent ratios between the carboxylic acids and the diamines being substantially the same. These polyamides are used as a base for hotmelt adhesives for the heat-resistant gluing of edge veneers, for example of polyvinyl chloride, to wooden boards. A dialkylated phenyl amine is used as antioxidant.
DE 42 11 125 describes a hotmelt adhesive which contains at least 50% by weight of polyamide based on dimerized fatty acid, 5 to 20% by weight of at least one ethylene copolymer from the group consisting of ethylene/vinyl acetate, ethylene/acrylate or ethylene/methacrylate, the alcohol component containing 1 to 18 carbon atoms, 2 to 10% by weight of a copolymer of styrene, ethylene and butylene, 5 to 25% by weight of hydroabietyl alcohol or polybutene, 0 to 10% by weight of at least one resin from the group consisting of polycyclopentadiene, polyterpene, liquid hydrocarbon resin and 0 to 15% by weight of a copolymer of ethylene or propylene and/or maleic acid. These hotmelt adhesives are used for bonding non-pretreated polyethylene and polyvinyl chloride or metals, more particularly copper, lead and aluminium, to one another or to themselves.
EP 40 926 describes a polyamide hotmelt adhesive based on at least one dimer fatty acid and at least one diamine. The amine is said to be used in excess. Irganox 1010, a sterically hindered phenol, is used as stabilizer.
Corresponding polyamides have been successfully used for bonding, sealing and filling moldings, more particularly moldings of PVC, polyamide and polyethylene, in the electrical industry. However, problems can arise under extreme temperature conditions. Thus, the PVC becomes black and brittle over prolonged periods at temperatures above 100.degree. C. The strands of cables can be removed with relatively little effort. The copper is corroded. These problems do not arise either in the case of PA alone or in the case of PVC alone, but only when the two materials come into contact with one another.


SUMMARY OF THE INVENTION

The problem addressed by the present invention was to stabilize the PVC so that it would be better able to withstand even extreme temperatures on contact with polyamides based on dimer fatty acids.
The solution provided by the invention is defined in the claims and essentially lies in the addition of at least one PVC heat stabilizer to the polyamide based on at least one dimer fatty acid.


DETAILED DESCRIPTION OF THE INVENTION

A substance may be regarded as a PVC heat stabilizer if it reduces the elimination of HCl from PVC at temperatures of 180.degree. to 200.degree. C. either as a function of time or in terms of quantity by comparison with PVC which has not been heat-stabilized with that substance. One method of measuring this dehydrochlorination is described in DIN 53381. A PVC material is stabilized when the stability time is reduced, the stability time being defined as the time in which a certain quantity of HCl has formed. A PVC may also be regarded as stabilized when the induction time (beginning of the elimination of HCl) is above 0 because non-stabilized PVC immediately gives off HCl.
Commercial PVC stabilizers may be combined into various groups, for example lead compounds, Ba, Cd, Ca and Zn salts of organic acids, organotin compounds, organic bases, organic phosphites, epoxy compounds and perchlorates.
Organotin compounds are understood to be compounds with at least one Sn-C bond corresponding to the gen

REFERENCES:
patent: 3531423 (1970-09-01), Stokes et al.
patent: 4777238 (1988-10-01), Leoni et al.
patent: 4810772 (1989-03-01), Leoni et al.
"Ullmanns Encyklopadie der technischen Chemie", vol. 15, pp. 261, 262 and 263 of the 4th Edition Kunststoffe (plastics).
Passchke, L.E. Peterson and D.H. Wheeler, Journal of the American Oil Chemists' Society, 41,723 (1964).

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