Polyamide base binder for use in metal powder injection molding

Details Polyamide base binder for use in metal powder injection molding Polyamide base binder for use in metal powder injection molding

1989-07-13

1991-03-26

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

524227, C08K 53477, C08K 517

Patent

active

050029886

ABSTRACT:
A polyamide binder for use in injection molding a metal powder comprising in combination: (a) 40 to 50 wt % of a polyamide resin component having an average molecular weight of not less than 20,000 and prepared by co-polycondensation of a mixture of dimer acid, azelaic acid, ethylenediamine and xylylenediamine each being mixed in a substantially equal molecular equivalent ratio; (b) 20 to 30 wt % of ethylene-bis-laurylamide; and (c) the balance of N,N-diacetylpiperazine.

REFERENCES:
patent: 4290935 (1981-09-01), Muraki
patent: 4395509 (1983-07-01), Blackwell et al.
patent: 4490324 (1984-12-01), Mollison
patent: 4500665 (1985-02-01), Breckev et al.
patent: 4684684 (1987-08-01), Abe et al.

Affiliated with

Also associated with

Rating

Polyamide base binder for use in metal powder injection molding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyamide base binder for use in metal powder injection molding , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyamide base binder for use in metal powder injection molding will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-617643