Polyamic acid copolymer system for improved semiconductor manufa

Details Polyamic acid copolymer system for improved semiconductor manufa Polyamic acid copolymer system for improved semiconductor manufa

1983-12-30

1986-05-20

Lee, Lester L.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

528188, C08G 7310

Patent

active

045902585

ABSTRACT:
A polyamic acid copolymer forming a polyimide comprising, in mole percent, from greater than 5 percent to about 45 percent pyromellitic dianhydride, from about 5 percent to about 45 percent oxydiphthalic dianhydride, and about 50 percent of oxydianiline. Polyimides formed by curing the copolymer are also disclosed as is a process for forming a heat sealable coating on or dielectric isolation layer within electronic circuitry using the copolymer.

REFERENCES:
patent: 4048142 (1977-09-01), Takekoshi
patent: 4454276 (1984-06-01), Uda et al.

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