Polyamic acid and polyimide

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From carboxylic acid or derivative thereof

Reexamination Certificate

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C528S310000, C528S335000

Reexamination Certificate

active

07906611

ABSTRACT:
Disclosed are a polyamic acid containing not less than 10 mol % of a repeating unit represented by the formula [1] below, and a polyimide represented by the formula [2] below which is obtained from such a polyamic acid. The polyamic acid and polyimide have high heat resistance as shown by a thermal decomposition temperature of not less than 300° C. In addition, the polyamic acid and polyimide have good workability because of their high solubility in solvents, while exhibiting good light transmission. (In the formula, R1and R2independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; R3and R4independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms or a phenyl group, or alternatively R3and R4on adjacent carbon atoms may combine together to form a cycloalkyl group having 3 to 8 carbon atoms or a phenyl group; R5represents a divalent organic group; and n represents an integer of not less than 2.)

REFERENCES:
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patent: 2000-63519 (2000-02-01), None
USPTO structure search, Nov. 2, 2010.
Hartmann, “Photosensibilisierte Addition von Maleinsäureanhydrid an terminale Alkine,” Chem. Ber., vol. 102, 1969, pp. 3974-3984.

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