Polyacetal resin composition and article thereof

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C524S211000

Reexamination Certificate

active

07816433

ABSTRACT:
A polyacetal resin composition comprising (A) 100 parts by mass of polyacetal resin generating formaldehyde in an amount of not more than 100 ppm when heated at a temperature of 200° C. for 50 minutes under the nitrogen atmosphere and (B) 0.01 to 5 parts by mass of a hydrazide compound can provide an article which is remarkably reduced in an emission amount of formaldehyde even though molded either at a higher temperature or under molding conditions wherein the resin temperature rises partially. Therefore, the polyacetal resin composition can be molded according to various molding methods and under a wide range of molding conditions. The article molded from the resin composition has succeeded in reducing the emission amount of formaldehyde, measured according to VDA275 method, to not more than 1 mg/kg, the level never achieved before, and therefore is usable for various applications where a reduced VOC is required.

REFERENCES:
patent: 5212222 (1993-05-01), Mitsuuchi et al.
patent: 5866671 (1999-02-01), Shinohara
patent: 6388049 (2002-05-01), Yokoyama et al.
patent: 6506850 (2003-01-01), Tanimura et al.
patent: 6673405 (2004-01-01), Harashina
patent: 2005/0018353 (2005-01-01), Tsukahara
patent: 0235927 (1987-09-01), None
patent: 51-111857 (1976-10-01), None
patent: 4-345648 (1992-12-01), None
patent: 8-041288 (1996-02-01), None
patent: 10-036630 (1998-02-01), None
patent: 10-298401 (1998-11-01), None
patent: 10298401 (1998-11-01), None
patent: 11-335519 (1999-12-01), None
patent: 2000-159850 (2000-06-01), None
patent: 2000-239484 (2000-09-01), None
patent: 2002-212384 (2002-07-01), None
patent: 95/16734 (1995-06-01), None
patent: 00/59993 (2000-10-01), None
patent: WO 01/51561 (2001-07-01), None
patent: 03/050186 (2001-12-01), None
Machine translation of JP 2000-159850.
English Language Abstract of JP 2000-159850.
English Language Abstract of JP 10-298401.
English Language Abstract of JP 10-036630.
English Language Abstract of JP 4-345648.
English Language Abstract of JP 11-335519.
English Language Abstract of JP 51-111857.
English Language Abstract of JP 2000-239484.
English Language Abstract of JP 2002-212384.
English Language abstract JP 10298401.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Polyacetal resin composition and article thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyacetal resin composition and article thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyacetal resin composition and article thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4239345

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.