Poly-hydroxynaphthalene compounds and epoxy resin composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

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525485, 525486, 528 97, 528153, C08G 812, C08L 6108, C08L 6302

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active

053026730

ABSTRACT:
Copolycondensation of .alpha.-naphthol and .beta.-naphthol with an aldehyde compound gives a poly-hydroxynaphthalene compound having an average molecular weight of 300 to 2,000. This compound is useful as a curing agent for epoxy resins and as a precursor of epoxy resins. Epoxy resin compositions include (1) compositions comprising an epoxy resin and the poly-hydroxynaphthalene compound as a curing agent and (2) compositions comprising an epoxy resin obtained by reacting the poly-hydroxynaphthalene compound with an epihalohydrin and a curing agent. The epoxy resin compositions of the invention are characterized in that the cured resins have a high glass transition temperature and high heat stability and high moisture resistance, scarcely allowing package cracking even in soldering treatment. Therefore the compositions are suited for use in encapsulating semiconductors.

REFERENCES:
patent: 4424315 (1984-01-01), Taylor et al.
"J62025116", Abstract No. 87-070254/10, Derwent, Inc., McClean, Va. (1987).
Chemical Abstracts, vol. 102, Abstract No. 132607.
Chemical Abstracts, vol. 109, Abstract No. 55366.

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