Poly(amide-imide) prepreg and composite processing

Coating processes – With post-treatment of coating or coating material – Solid treating member or material contacts coating

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427370, 4273741, 4273742, 4273743, 427379, 4273855, 4273898, 4273899, 4273891, 428287, 428290, 4284735, 523222, 523309, 524600, B29D 900

Patent

active

048987549

ABSTRACT:
A method is disclosed for forming poly(amide-imide) prepregs that permits forming void-free composites having residual solvent contents of less than 0.2% by weight. Such composite have improved glass transition temperatures near those of the pure polymer. In a preferred method, a poly(amide-imide) prepreg containing a residual N-methyl-2-pyrrolidone solvent is rapidly heated to about 650.degree. F. to evaporate residual solvent to less than 1.0% by weight. The prepreg is rapidly cooled before the thermoplastic poly(amide-imide) polymer begins to significantly advance in molecular weight. The prepreg may then be layed up to form composite articles that are consolidatable by application of further heat and pressure.

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