Polishing uniformity via pad conditioning

Details Polishing uniformity via pad conditioning Polishing uniformity via pad conditioning

2006-03-07

2006-03-07

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

With tool treating or forming

C451S443000, C451S285000

Reexamination Certificate

active

07008301

ABSTRACT:
According to an example embodiment, the present invention is directed to a CMP apparatus having a polishing table, a wafer carrier adapted to carry a wafer on a pad, and a conditioning wheel. If the pad is being polished in a center-fast or center-slow manner, the conditioning wheel is used to condition the pad and to improve the center-fast or center-slow condition. Benefits of using this embodiment include improved wafer quality, improved pad life, a reduction in defective wafers, and faster production.

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patent: 6254456 (2001-07-01), Kirchner et al.
patent: 6276989 (2001-08-01), Campbell et al.

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