Polishing tape used in production of magnetic recording medium

Details Polishing tape used in production of magnetic recording medium Polishing tape used in production of magnetic recording medium

2005-06-14

2005-06-14

Juska, Cheryl (Department: 1771)

Stock material or miscellaneous articles

Pile or nap type surface or component

Flock surface

C428S092000, C428S097000, C428S903000, C428S932000, C442S189000, C442S201000

Reexamination Certificate

active

06905752

ABSTRACT:
Disclosed is a tape for polishing the surface of a substrate of a magnetic recording medium, and a thin-fineness filament obtained by dissolving a dissolving component of a dissolution-decomposition type composite yarn consisting of a nylon component and the dissolving component is used as piles of a flocked cloth, warps of a fabric, and webs of a nonwoven fabric.The polishing tape of the present invention can noticeably improve the surface roughness of the polished substrate.

REFERENCES:
patent: 5877098 (1999-03-01), Tanaka et al.
patent: 5899794 (1999-05-01), Shige et al.
patent: 6074284 (2000-06-01), Tani et al.
patent: 2004/0162010 (2004-08-01), Ohno et al.
patent: 06295432 (1994-10-01), None
patent: 07244845 (1995-09-01), None
patent: 08096355 (1996-04-01), None
patent: 11114793 (1999-04-01), None
patent: 11203667 (1999-07-01), None
patent: 2000182237 (2000-06-01), None
patent: 2001179588 (2001-07-01), None
patent: 2001179594 (2001-07-01), None
patent: 2001179595 (2001-07-01), None
patent: 2002331465 (2002-11-01), None
patent: WO 9910569 (1999-03-01), None

Affiliated with

Also associated with

Rating

Polishing tape used in production of magnetic recording medium does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing tape used in production of magnetic recording medium, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing tape used in production of magnetic recording medium will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3494747