Polishing systems, methods of polishing substrates, and method o

Details Polishing systems, methods of polishing substrates, and method o Polishing systems, methods of polishing substrates, and method o

1997-12-04

1999-12-28

Smith, James G.

Abrading

Abrading process

Utilizing fluent abradant

451 41, B24B 700

Patent

active

06007406&

ABSTRACT:
The invention encompasses polishing systems for polishing semiconductive material substrates, and encompasses methods of cleaning polishing slurry from semiconductive substrate surfaces. In one aspect, the invention includes a method of cleaning a polishing slurry from a substrate surface comprising: a) providing a substrate surface having a polishing slurry in contact therewith; b) providing a liquid; c) injecting a gas into the liquid to increase a total dissolved gas concentration in the liquid; and d) after the injecting, providing the liquid against the substrate surface to displace the polishing slurry from the substrate surface. In another aspect the invention includes a method of polishing a substrate surface comprising: a) providing a polishing slurry between a substrate surface and a polishing pad; b) polishing the substrate surface with the polishing slurry; and c) removing the polishing slurry from the substrate surface, the removing comprising: i) providing a liquid; ii) removing a first gas from the liquid to reduce a total dissolved gas concentration in the liquid; iii) after the removing, dissolving a second gas in the liquid to increase the total dissolved gas concentration in the liquid; iv) after the dissolving, providing the liquid between the substrate surface and the polishing pad to displace the polishing slurry from the substrate surface.

REFERENCES:
patent: 5783790 (1998-07-01), Mitsumori et al.
patent: 5797789 (1998-08-01), Tanaka et al.
patent: 5885134 (1999-03-01), Shibata et al.
patent: 5887605 (1999-03-01), Lee et al.

Affiliated with

Also associated with

Rating

Polishing systems, methods of polishing substrates, and method o does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing systems, methods of polishing substrates, and method o, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing systems, methods of polishing substrates, and method o will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2378595