Polishing system with underwater Bernoulli pickup

Abrasive tool making process – material – or composition – With carbohydrate or reaction product thereof

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Details

51235, 51418, B24B 700

Patent

active

046532315

ABSTRACT:
An automatic polishing system for polishing semiconductor material is described. A robot and Bernoulli pickup are used to retrieve polished wafers from an underwater unload station which is located on a wafer polisher. The polished wafer is then deposited into a cassette which is located underwater.

REFERENCES:
patent: 3701222 (1972-10-01), Testolin
patent: 3993301 (1976-11-01), Vits
patent: 4002246 (1977-01-01), Brandt
patent: 4141180 (1979-02-01), Gill
patent: 4184292 (1980-01-01), DeFazio et al.
patent: 4555876 (1985-12-01), Ohtake

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