Polishing system with stopping compound and method of its use

Details Polishing system with stopping compound and method of its use Polishing system with stopping compound and method of its use

2005-02-15

2005-02-15

Chen, Kin-Chan (Department: 1765)

Compositions

Etching or brightening compositions

C051S309000

Reexamination Certificate

active

06855266

ABSTRACT:
The invention provides a system for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polishing additive that increases the rate at which the system polishes at least one layer of the substrate, (iv) at least one stopping compound with a polishing selectivity of the first metal layer:second layer of at least about 30:1, and (v) a polishing pad and/or an abrasive. The invention also provides a composition comprising (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polishing additive (iv) at least one stopping compound with a polishing selectivity of the first metal layer:second layer of at least about 30:1, to be used with (v) a polishing pad and/or an abrasive.

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