Abrading – Machine – Combined
Patent
1998-03-27
2000-08-08
Eley, Timothy V.
Abrading
Machine
Combined
51298, 51307, 451527, 451550, B24B 700
Patent
active
060993944
ABSTRACT:
A chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices or the like. The invention is directed to a self-dressing, polishing pad comprising a high modulus phase and a low modulus phase. The multi-phase polishing pads are very efficient and effective in providing high performance polishing along an entire polishing surface interface.
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Brown, Norman J., "Lapping: Polishing and Shear Mode Grinding", Lawrence Livermore National Laboratory.
Kalpakjian, Serope, "Manufacturing Processes for Engineering Materials", Addison-Wesley Publishing Company, p. 557, (1984).
Budinger William D.
Chechik Nina G.
James David B.
Levering, Jr. Richard M.
Oliver Michael R.
Benson Kenneth A.
Eley Timothy V.
Kaeding Konrad H.
Rodel Holdings Inc.
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