Polishing state monitoring method

Details Polishing state monitoring method Polishing state monitoring method

2007-06-27

2008-10-21

Eley, Timothy V (Department: 3724)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S006000, C451S008000, C451S041000, C451S063000

Reexamination Certificate

active

07438627

ABSTRACT:
A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.

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