Polishing solution and method of polishing nonferrous metal...

Details Polishing solution and method of polishing nonferrous metal... Polishing solution and method of polishing nonferrous metal...

2006-08-15

2006-08-15

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

Utilizing fluent abradant

C451S559000, C451S060000

Reexamination Certificate

active

07090564

ABSTRACT:
A polishing solution, comprising copper ions and chloride ions in Cu/Cl molar ratio of 10−1to 103and at pH 0.5 to 10, is suited for polishing a surface composed of a nonferrous metal material such as copper or copper alloy. Thicker metal film can be polished at high removal rate, so that distribution in film thickness becomes uniform.

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patent: 6783432 (2004-08-01), Li et al.
patent: 2004/0172886 (2004-09-01), Grunwald
patent: 2004/0226915 (2004-11-01), Ono et al.
patent: 2000-119638 (2000-04-01), None
patent: 2001-68437 (2001-03-01), None

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