Abrasive tool making process – material – or composition – With inorganic material
Reexamination Certificate
2005-03-11
2008-12-30
Marcheschi, Michael A (Department: 1793)
Abrasive tool making process, material, or composition
With inorganic material
C051S308000, C051S309000, C106S003000
Reexamination Certificate
active
07470295
ABSTRACT:
Disclosed herein is a polishing slurry for chemical mechanical polishing. The polishing slurry comprises polishing particles, which have a particle size distribution including separated fine and large polishing particle peaks. The polishing slurry also comprises polishing particles, which have a median size of 50-150 nm. The present invention provides the slurry having an optimum polishing particle size, in which the polishing particle size is controlled and which is useful to produce semiconductors having fine design rules by changing the production conditions of the slurry. The present invention also provides the polishing slurry and a method of producing the same, in which a desirable CMP removal rate is assured and scratches are suppressed by controlling a polishing particle size distribution, and a method of polishing a substrate.
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English Translation of First Office Action corresponding to Chinese Patent Application No. 200480012926.7 dated Oct. 12, 2007.
Hong Seok Min
Jeon Jae Hyun
Kim Dae Hyung
Kim Ho Seong
Kim Yong Kuk
IUCF-HYU
K.C. Tech Co., Ltd.
Marcheschi Michael A
Marger Johnson & McCollom PC
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