Polishing slurry and polishing method using the same

Details Polishing slurry and polishing method using the same Polishing slurry and polishing method using the same

1999-03-09

2000-10-03

Scherbel, David A.

Abrading

Abrading process

Utilizing fluent abradant

51307, 51308, 106 3, 451 41, B24D 302

Patent

active

061265144

ABSTRACT:
A polishing slurry includes polishing abrasive grains and a polishing liquid containing at least one kind of a fatty acid and a fatty acid ester. The fatty acid is at least one kind selected from a group consisting of oleic acid, myristic acid, and stearic acid. The fatty acid ester is at least one kind selected from a group consisting of butyl stearate, hexyl stearate, heptyl stearate, butyl oleate, hexyl oleate, heptyl oleate, butyl myristate, hexyl myristate, and heptyl myristate. The polishing slurry is used for polishing a surface to be polished of a substance to be polished such as a wafer by bringing the surface to be polished into slide-contact with a polishing surface of a polishing plate mounted to a polishing table while supplying the polishing slurry on the polishing surface. The polishing slurry solves such a related art problem that upon CMP of an interlayer insulating film having a step, a polishing pressure applied to a lower portion of the step becomes equal to that applied to an upper portion of the step, to make the polishing rate at the lower portion of the step nearly equal to that at the upper portion of the step, thereby making it difficult to flatly polish the interlayer insulating film.

REFERENCES:
patent: 4664679 (1987-05-01), Kohyama et al.
patent: 5139571 (1992-08-01), Deal et al.
patent: 5207759 (1993-05-01), Mehmandoust et al.
patent: 5480476 (1996-01-01), Cook et al.
patent: 5700383 (1997-12-01), Feller et al.
patent: 5800577 (1998-09-01), Kido
patent: 5846122 (1998-12-01), Graebner et al.

Affiliated with

Also associated with

Rating

Polishing slurry and polishing method using the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing slurry and polishing method using the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing slurry and polishing method using the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-189645