Polishing slurry and polishing method

Details Polishing slurry and polishing method Polishing slurry and polishing method

2004-05-28

2011-12-13

Norton, Nadine G (Department: 1713)

Compositions

Etching or brightening compositions

C252S079200, C252S079300, C252S079400, C438S692000, C216S088000

Reexamination Certificate

active

08075800

ABSTRACT:
A polishing slurry containing a slurry dispersing particles of tetravalent metal hydroxide in a medium therein and an additive, characterized in that the additive is a polymer containing at least one kind of monomer component selected from a group of monomers represented with a general formulae (I) and (II) below (In the general formulae (I) and (II), R1denotes hydrogen, a methyl group, a phenyl group, a benzil group, a chlorine group, a difluoromethyl group, a trifluoromethyl group or a cyano group, R2and R3denote hydrogen or an alkyl chain having 1 to 18 carbon atoms, a methylol group, an acetyl group or a diacetonyl group, and a case where both are hydrogen is not included. R4denotes a morpholino group, a thiomorpholino group, a pyrrolidinyl group or a piperidino group.) The invention provides a polishing slurry in which particles form a chemical reaction layer with a polishing film to be removed with a very small mechanical action of the particles and mechanical removal by a pad without scratches and the additive realizes high planarity.

REFERENCES:
patent: 3123452 (1964-03-01), Harris
patent: 6143643 (2000-11-01), Carter et al.
patent: 6190443 (2001-02-01), Ohashi et al.
patent: 6372003 (2002-04-01), Kasai et al.
patent: 6689692 (2004-02-01), Grover et al.
patent: 2003/0124959 (2003-07-01), Schroeder et al.
patent: 8-22970 (1996-01-01), None
patent: 10-106994 (1998-04-01), None
patent: 2001-57351 (2001-02-01), None
patent: 2001064688 (2001-03-01), None
patent: 2001-107089 (2001-04-01), None
patent: 2002-241739 (2002-08-01), None
S. Wolf , (Silicon Processing for the VLSI Era, vol. 4—Deep Submicron Process Technology, Lattice Press, 2002, pp. 352).
Forms PCT/IB/338 and PCT/IPEA/409 of International Application PCT/JP2004/007746 mailed Dec. 1, 2005.
Ginya Adachi, Kidorui no Kagaku (Scien of Rare Earths), Kagaku-Dojin Publishing Company, pp. 304-305.

Affiliated with

Also associated with

Rating

Polishing slurry and polishing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing slurry and polishing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing slurry and polishing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4271301