Polishing slurries comprising two abrasive components and method

Details Polishing slurries comprising two abrasive components and method Polishing slurries comprising two abrasive components and method

1995-10-10

1997-12-02

Breneman, R. Bruce

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

216 89, 216100, 216102, 216105, 252 791, 51309, C23F 100, C23F 144

Patent

active

056932391

ABSTRACT:
An aqueous slurry is provided for polishing or planarizing a work piece which contains a metal, the solids portion of said slurry being comprised of 1 to 50 percent by weight of submicron alpha-alumina, the remainder of the solids being of a substantially less abrasive composition chosen from the group consisting of aluminum hydroxides, gamma-alumina, delta-alumina, amorphous alumina, and amorphous silica. Also provided is a method for polishing the surface of a work piece which contains a metal wherein said aqueous slurry is used as the polishing composition during chemical-mechanical polishing.

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