Polishing silicon wafers

Details Polishing silicon wafers Polishing silicon wafers

2005-12-06

2005-12-06

Nguyen, George (Department: 3723)

Abrading

Machine

Endless band tool

C451S533000, C451S536000

Reexamination Certificate

active

06971950

ABSTRACT:
An endless belt for a belt type polishing machine comprises a support fabric and a polymer layer of relatively low hardness. The polymer layer is formed with drainage grooves. The support fabric may comprise a non woven or woven material, or a membrane with oriented reinforcing yarns. A further version comprises a spiral-link fabric supporting a woven or non woven layer carrying the polymer layer. The polymer layer may be a double layer, the upper of which is either harder or softer than the lower layer.

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